D3.2 Catalogue of available services for reliability testing

Mechanical and thermal stress, corrosion and contamination all have a major impact on reliability of electronic assemblies. Identifying reliability issues associated with lead-free SMT packaging, failure mechanisms of SMT packaging and the introduction of reliability testing equipment, methods, and models will be achieved in the PW Reliability Laboratory.

For industrial implementation of lead ? free materials are necessary important changes in process parameters (temperature, tolerances), auxiliary materials (fluxes, pastes) and manufacturing equipment. One of the most important problems of these changes is the warranty of good quality and reliability of electrical joints realized in new, environment - friendly technology. Especially for small electronic enterprises it will be difficult to prove that the product reliability is not lower than before the change. One of the solutions is application of appropriate accelerated tests. For these tests following services for accelerated reliability testing procedures and services will be offered by the PW reliability laboratory and other GreenRoSE partners:

Preparatory activities:

• Performance of PCB samples
• Supply of components
• Supply of materials
• Quality evaluation
• Samples assembly

Reliability tests:

• Thermal shock cycling
• Electrical power cycling
• Mechanical cycling,
• measurements of shearing force,
• FEM modelling,

Evaluation activities

• Failures investigations
• statistical analysis.

For failure detection during the tests following methods are applied:

• microscopic observations,
• static resistance measurements,
• oscilloscopic registration
• metallographic investigations.

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